Technology
Display and Semiconductor Technology
Fonon DSS (Display & Semiconductor systems) is a division of Fonon Technologies, the world renowned inventor and manufacturer of Zero Width Laser Cutting Technology™. Fonon DSS focuses on the semiconductor and flat panel display industry, utilizing the patented technologies below which demonstrate the highest level of precision known to man.
Our patented technologies include:
- ZWLCT® – Zero Width Laser Cutting Technology
- Thin Glass Laser Scribing Technology
- Glass Wafer fabricating Technology
- Hard Drive Glass Platter manufacturing technology
- FPD Laser Scribing technology
- Si Wafer Laser Dicing technology
QLWT® – Quartz Laser Welding Technology
- “Butt” Welding for Continues Optical Fiber Fabrication technology
- Extra thick Quartz Glass Welding Technology
- ELPGT® – Extra Low Pressure Grinding Technology
- Aerospace Windows Re-polishing Process and equipment
- Additive manufacturing technology
- 3D Laser Sintering
- Laser Based Selective Melting
- Laser “Comb” annealing and Re-crystallization Technology
- Laser Marking and Engraving Technology
- Fiber Laser marking technology
- UID Laser marking and Engraving
- Handheld laser Marking
- Service marks and ID for Weapons, Ammunition, Bomb Shells, Missiles, Hi pressure vessels, Pipeline weld quality
- 3D Laser Engraving technology
- High Power fiber Laser Technology
- Equipment and Technology for High Power Laser Cutting
Fonon Technologies was established in 1991 as an R&D company by a group of high-level scientists and engineers as a result of research and development in three major worldwide patented technologies in the hi-tech industry: Fiber Laser Material Processing Technology, Zero Width Laser Cutting Technology™, Solid State Lapping® (SSL), and Quartz Laser Welding Technology® (QLWT).
Fonon DSS continues to develop and manufacture state-of-the-art equipment and Technologies for glass scribing, cutting and breaking, wafer dicing, ITO ablation, Direct Patterning, Direct Laser Component Marking, Fiber Laser Material Processing solutions, UID, Portable Laser Systems, and more to our customers in the FPD, Semiconductor and Electronics industries throughout the world.
Display
Fonon DSS was the first in the world to develop a laser scribing system with simultaneous Laser Scribe and Break capabilities for singulation of Flat Panel Display panels specifically for Generation 6 and 8 Glass panels.
Semiconductor
Wafers have the highest value at the dicing stage and the primary focus of FWLDT® is to increase the number of dies, yield per wafer, and to maximize throughput while minimizing the HAZ specifically for “power hungry” RF micro devices and low-K wafer substrates.
Fonon DSS System is applicable for dicing of assorted semiconductor materials such as silicon (Si), gallium arsenide (GaAs), germanium (Ge), indium phosphide (InP), silicon carbide (SiC), gallium nitride (GaN), gallium phosphide (GaP), other compound materials, as well as low-k and multi-layer composite-materials.
Significant Advantages of Dicing and Separation Technology:
The possibility of a cut with zero or 20 micron narrow width (application specific) allows wafer layout designers to reduce the width of the spacing between adjacent die on a wafer. The spacing is normally reserved to allow for the width of the saw used to cut the wafer. A reduction of the spacing width will result in an increase of the real estate available for die, which will result in a significant reduction of the cost per die.