3D Laser Deep-Engraving Material Processing System Contract awarded to Fonon Technologies by Custom Firearms Manufacturer
Fonon Technologies Awarded 3D Laser Deep-Engraving Material Processing System Contract by Custom Firearms Manufacturer
Lake Mary, FL – Fonon Technologies, a laser-based systems provider for both 3D Subtractive Materials Processing Systems and 3D Additive Materials Manufacturing Systems awarded contract by Custom Firearms Manufacturer.
Fonon Technologies’ LaserTower™ MegaCenter is the largest, industrial-grade high-volume deep-engraving system in the industry supporting a working area of 42” by 42”
Fonon Technologies is pleased to announce that a custom firearms manufacturer has purchased their second 3D LaserTower™ MegaCenter to support deep-engraving applications. The company purchased their first MegaCenter over 7 years ago. Under continuous high-usage, we are pleased to report they have experience no services issues to date. As their business continues to expand, they have purchased a second high-volume, deep-engraving system to keep pace with demand.
Fonon Technologies’ Family of LaserTower™ Marking & Engraving Systems is a new generation of 3D Laser Subtractive Materials Processing Systems for Direct Parts Marking, UID/UDI Barcoding and Deep Engraving applications. They are the most advanced, compact, industrial-grade laser marking and engraving systems available in the market.
Fonon Technologies has the largest array of laser based systems in the 3D Subtractive and 3D Additive Materials Processing Industry. The company’s area of expertise is tooling application specific laser-based material processing systems based on the unique requirements of industry specific sectors including medical, automotive, aviation, aerospace, military, marine and industrial.
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Fonon Technologies is the recognized leader of industrial grade 3D Additive and 3D Subtractive laser-based material processing systems. We offer cutting-edge Additive Manufacturing Solutions for 3D Metal Printing Systems based on Direct Metal Laser Sintering (DMLS) and Subtractive Manufacturing Solutions for 3D Marking, Engraving and Cutting Systems including our patented OWCT™ Zero Width laser Cutting Technology for glass, silicon and other brittle materials. Our systems are used world-wide in the semiconductor, flat panel display, automotive, aerospace, industrial, defense, electronic and medical industries with a portfolio of intellectual property, knowhow & inventions placing our company in the unique position to offer both standard 3D material processing systems or our specialty of tooling 3D laser-based transforming systems designed around the unique applications of our customers.
To learn more about Fonon Technologies, visit: https://fonon.us
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