Fonon Corporation’s 3D FUSION™ Technology Eliminates Continuous Fluctuations in Laser Focal Point in Next-Generation Specialized 3D Metal Printing Systems
May 28, 2015
Fonon’s Direct Metal Laser Sintering (DMLS) systems provide end-users with optimum control of the laser’s focal point improving density while eliminating beam-spot and power distribution fluctuations
May 28th, 2015, LAKE MARY, FL-(Business Wire)-Fonon Corporation’s (“Fonon”) (OTCQB:MBMI) 3D Additive Manufacturing Systems eliminate product variations associated with Galvo scan heads. Standard 3D metal printing systems that use fixed position lasers incorporate Galvo scan head mirrors to deflect the laser beam across build plate sizes of 250mm x 250mm. Increasing the F-Theta lens allow build plates to extend to 400mm x 400mm.
The optimum focal point of a Fiber laser is orthogonal to the build area. As you incrementally deflect the laser beam away from perpendicular towards the extreme boundaries of the build plate, the optimum focal point deteriorates respectively. During each layer of the build cycle, the focal point is constantly changing across the entire build plate. Fonon does not incorporate Galvo scan heads providing end-users with the optimum laser focal point across the entire build plate throughout all layers of the build cycle.
Fonon Corporation’s proprietary Additive Manufacturing Laser is at the optimal focal point throughout the build cycle eliminating the use of a Galvo scanhead.
About Fonon Corporation
Fonon Corporation is the recognized leader of industrial-grade 3D Additive and Subtractive laser-based material processing systems. Our systems are used world-wide in the semiconductor, flat panel display, automotive, aerospace, industrial, defense, electronic and medical industries with a portfolio of intellectual property, knowhow & inventions placing our company in the unique position to offer both standard 3D material processing systems or our specialty of tooling 3D laser-based transforming systems designed around the unique applications of our customers.
To learn more about Fonon Corporation, visit: https://fonon.us
Notice Regarding Forward-Looking Statements
NOTE: This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 involving risks and uncertainties. Results, events and performances could vary from those contemplated. These statements involve risks and uncertainties which may cause results, expressed or implied, to differ from predicted outcomes. Risks and uncertainties include but are not limited to product demand, market competition and the company’s ability to meet current and future plans. Investors should study and understand all risks before making an investment decision. Readers are recommended not to place undue reliance on forward-looking statements or information. Fonon is not obligated to publicly release revisions to any forward-looking statement, to reflect events or circumstances afterward, or to disclose unanticipated occurrences except as required under applicable law.
Contact Information
Robert Hunt
Investor Relations
407-477-5618 x1010
Fonon Corporation’s FUSION™ Technology Incorporates Industry’s First Additive Manufacturing Laser Optimized For 3D Metal Printing Systems
May 20, 2015
Fonon’s Direct Metal Laser Sintering (DMLS) Systems expand end-user laser management practices while increasing production throughput.
LAKE MARY, FL-(Business Wire-May 20, 2015)(OTCQB:MBMI)-Fonon Corporation’s (“Fonon”) 3D Additive Manufacturing laser empowers end-users with improved laser management practices to control product density and specification while reducing build rate cycle times. Standard 3D metal printing systems that incorporate Fiber lasers exhibiting a Gaussian shaped power density profile are unable to adequately control the uniform melting of NANO-powders. Fluctuating laser power during operation directly impacts quality control management of density. Fonon’s high-frequency laser provides a flat, uniform power density ensuring the metal powders are melted with no variation during the build cycle.
Representative power density profiles
Higher laser wattages typically equate to larger beam spot sizes that are undesirable for end-user’s production control of specification tolerances yet directly relates to faster processing speeds. Fonon’s 1KW laser is 95% scalable combining the benefits of faster processing speeds with the ability for end-users to control the beam spot size during critical areas of the build layer.
About Fonon Corporation
Fonon Corporation is the recognized leader of industrial-grade 3D Additive and Subtractive laser-based material processing systems. Our systems are used world-wide in the semiconductor, flat panel display, automotive, aerospace, industrial, defense, electronic and medical industries with a portfolio of intellectual property, knowhow & inventions placing our company in the unique position to offer both standard 3D material processing systems or our specialty of tooling 3D laser-based transforming systems designed around the unique applications of our customers.
To learn more about Fonon Corporation, visit: https://fonon.us
Notice Regarding Forward-Looking Statements:
NOTE: This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 involving risks and uncertainties. Results, events and performances could vary from those contemplated. These statements involve risks and uncertainties which may cause results, expressed or implied, to differ from predicted outcomes. Risks and uncertainties include but are not limited to product demand, market competition and the company’s ability to meet current and future plans. Investors should study and understand all risks before making an investment decision. Readers are recommended not to place undue reliance on forward-looking statements or information. Fonon is not obligated to publicly release revisions to any forward-looking statement, to reflect events or circumstances afterward, or to disclose unanticipated occurrences except as required under applicable law
Fonon Corporation Announces LaserTower™ Compact Marking and Engraving System Rental Program
May 18, 2015
Rental Program Provides New End-Users with Lower Risk Financial Options
Fonon Corporation (“Fonon”) announces new rental program geared towards first time end-users who seek to vertically integrate marking and engraving services into their product lines. Fonon’s rental program provides emerging new customers with lower risk financial options to add direct parts marking services to their products prior to making a large capital equipment investment.
Fonon’s rental program spotlights the company’s LaserTower™ Compact as the optimum entry-level system for emerging new customers. The LaserTower™ Compact is an industrial-grade system designed to operate under continuous high-vibration, shock and dust conditions with a MTBF of 50,000 hours. The marking and engraving system meets all FDA, OSHA and CDHR requirements with operator safety paramount including magnetically locked door verification, dual-button operator safety controls and programmable logic control to prevent the premature firing of the laser.
Maintenance-Free Direct Part Marking (DPM)- Continuous operation under high-shock, vibration and dust conditions
- Long-term industrial-grade reliability with 50,000 hours MTBF
- Optimized for either a Fiber or CO² Laser
- Standard wall plug operation with high electrical efficiency
- Low voltage power source (110/220 VAC) 8 amps
- Laser “ON” magnetically locked front door for operator safety
- Compact design for space sensitive workspaces
- Large chamber provides a 19” by 19” material working area
- 4” Z-Axis Controller to accommodate a broad range of heights
- Class 1 or Class 4 Laser-Rated Safety Viewing Port
- PC-Based Controller, Flat Panel Monitor, Mouse and Keyboard
- Industrial-grade Extruded Frame with 19” Rack Mount Design
- Exhaust outlet for Fume Extractor
- Side Doors for longer parts (optional)
Click-Here for LaserTower Compact System Specification.
Fonon Corporation Announces FUSION™ Technology as the Company Officially Enters the 3D Metal Printing System Market
May 18, 2015
Fonon Corporation Announces FUSION™ Technology as the Company Officially Enters the 3D Metal Printing System Market
Fonon Corporation’s business model is to design application specific 3D Direct Metal Laser Sintering (DMLS) systems dedicated to a common cluster of industry specific geometric shares optimized for one metal type.
LAKE MARY, FL-(BusinessWire-May 18, 2015)-Fonon Corporation (OTCQB:MBMI) (“Fonon”) believes experienced end-users are now ready to transition to application specific Additive Manufacturing Systems to address highly complex projects that are unable to move past prototype. The timing of this transition from “standard” systems to “specialized” systems aligns with the company’s strategic timing to enter the 3D metal printing systems market. Based on the company’s proprietary FUSION™ technology, next-generation 3D Additive Manufacturing Systems will address shortfalls in density control, laser power management, NANO-powder behavior under high-temperature processing, provide real-time repair vision systems and increase build plate architectures an order of magnitude.
About Fonon Corporation
Fonon Corporation is the recognized leader of industrial-grade 3D Additive and Subtractive laser-based material processing systems. Our systems are used world-wide in the semiconductor, flat panel display, automotive, aerospace, industrial, defense, electronic and medical industries with a portfolio of intellectual property, knowhow & inventions placing our company in the unique position to offer both standard 3D material processing systems or our specialty of tooling 3D laser-based transforming systems designed around the unique applications of our customers.
To learn more about Fonon Corporation, visit: https://fonon.us
Notice Regarding Forward-Looking Statements:
NOTE: This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 involving risks and uncertainties. Results, events and performances could vary from those contemplated. These statements involve risks and uncertainties which may cause results, expressed or implied, to differ from predicted outcomes. Risks and uncertainties include but are not limited to product demand, market competition and the company’s ability to meet current and future plans. Investors should study and understand all risks before making an investment decision. Readers are recommended not to place undue reliance on forward-looking statements or information. Fonon is not obligated to publicly release revisions to any forward-looking statement, to reflect events or circumstances afterward, or to disclose unanticipated occurrences except as required under applicable law.
3D Laser ZWLCT Glass Cutting Systems
May 14, 2015
Fonon’s 3D Laser ZWLCT™ Glass Cutting Systems Have No Peers…
Fonon Technologies’ patented Zero Width Laser Cutting Technology (ZWLCT™) is a major discovery that remains the superior technology of choice today by Mother Glass Foundries. The demand for these systems remains high as new off-shore Flat Panel Display, Semiconductor and Electronic manufacturing facilities continue to emerge globally to support new market growth and cost reduction initiatives.
Zero Width Laser Cutting Technology has been optimized for thin-glass applications up to 1.0mm.
No other competing technology comes close to matching the superior performance of Fonon Technologies’ ZEROKerf™ glass cutting technology. Our patented process significantly increases edge quality and strength. Edge Impact Strength is increased up to 10 times when compared to full-contact mechanical scribe and break systems, while overall Glass Component Strength is improved up to 80%. ZWLCT™ splits materials at the molecular level under a non-contact process with tremendous speed resulting in no material loss, chips, lateral cracks, protrusions, hooks and flares or any other forms of contaminants.
CLICK HERE FOR ZWLCT™ SEM REPORT
ZWLCT™ eliminates surface degradation 100%, resulting in zero yield loss due to particulate damages across the glass surface caused by undesirable contaminates created by conventional mechanical scribe methods.
ZWLCT™
At the molecular level, Fonon Technologies’ patented ZWLCT™ generates a controlled MicroCrack™ to any selectable depth through glass (and other brittle materials) at a controlled, optimized angle to the surface of the material. By controlling the laser beam’s energy distribution under a proprietary temperature stress profile, the process creates scribe lines in a prescribed manner with no molecules leaving the surface of the glass, dramatically improving the substrate separation process.
The ZWLCT™ method incorporates cooling of the glass surface following controlled heating with the correct power density profile. This creates the intermolecular separation of the glass substrate to a predetermined depth.
Fonon Technologies’ 3D Laser ZWLCT™ Glass Cutting Systems can also be modified to enable the crossing of the laser cuts to provide a complete turnkey ZeroCut™ high-volume wafer dicing station.
Manufacturers and consumers benefit immediately from higher material strength as Fonon Technologies’ patented ZWLCT™ technology reduces production and handling damages at the factory while reducing premature latent product failures in the field due to shock.
Fonon Technologies optimizes each 3D Laser ZWLCT™ Glass Cutting System in response to continual advancements of customer applications.
Advantages of ZWLCT™ include:
- High cutting speed up to 1000 mm/sec
- Extremely high accuracy up to 10 microns achievable
- No post treatment of edges, such as grinding or edge seaming required
- Process unlimited component sizes up to Gen-10 and higher
- Easily adaptable to glass thickness changes during production
- Increased glass strength with no material loss or latent defects
- Excellent surface integrity of cut surface with no cracks or chips
- Precise edge geometries with almost any possible contour
- Edge Impact Strength up to 10X that of mechanical scribe & break methods
- Cut edges free of stress with Glass Component Strength improved 80%
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FLAT PANEL DISPLAY Processing Flat Panel Display Glass with ZWLCT™ technology improves edge impact strength up to 10 times and overall component strength up to 80% compared to conventional mechanical scribe methods. Fonon’s ZWLCT™ glass cutting systems reduce manufacturing costs, increase profit margins and dramatically increase yields providing a turnkey system that simultaneously laser scribes and breaks in one system. |
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THIN FILM TRANSISTORS (TFT) TFT liquid crystal displays improve image qualities including addressability and contrast in computer monitors, mobile phones, navigation systems, hand-held video game systems and television sets. Incorporating ZeroCut™ technology ensures the break line is the scribe line with no lateral cracks, serrations, surface deterioration or abasement. Fonon’s patented ZWLCT™ increases both the number of die and yield count of each TFT wafer continuing to lower production costs and increasing profit margins. |
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GLASS SEMICONDUCTOR WAFERS Wafers have the highest value at the dicing stage. It is critical from this point forward through the rest of the manufacturing process to maintain the highest yields and die count. Wafer Carriers, LEDs, Optical Sensors & Detectors, CMOS Image Sensors and Bonding Silicon-On-Insulators to glass wafers incorporating ZWLCT™ allow closer die spacing increasing the number of die/wafer. With no material breaching or fissures, yields are dramatically improved lowering production costs while eliminating potential latent field failures. |
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OPTICAL COLOR FILTERS Optical color filters are widely used in CRT Display, LCD, FED, CCD, Electronic Instrumentation, Telecommunication and Medical Devices. With 3D ZEROKerf™ processed glass, there are no chips, protrusions, scallops or hooks & flares materially increasing quality and longterm reliability while measurably reducing production costs. |
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SOLAR PANEL WAFERS Solar Panel Photovoltaic Wafers enhanced with ZWLCT ™ boost yields as scribe lines are created in a predetermined manner with no molecules leaving the surface of the material. Solar Panel manufacturing throughput rates increase dramatically. ZWLCT™ lowers manufacturing costs, increases profit margins and improves the quality of Solar Panel Wafers. |
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SCANNING MIRRORS Even Fonon’s 3D Metal Printer Systems and 3D Material Processing Systems benefit from ZEROKerf™ processed scanning mirrors used on Galvo Scan Heads as there is no breaching of the breaking crack into the body of the material. Fonon’s patented ZWLCT ™ provides the highest quality and long-term reliability for all glass cutting applications |
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HARD DISK DRIVES (HDD) Hard Disk Drives store and retrieve digital information using rapidly rotating platters coated with magnetic material. Fonon’s patented ZWLCT ™ Technology is a non-contact 3D laser stress-free process that dramatically increases yields as there are no contaminants generated to degrade the working surface of data storage disks. |
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MULTI-VESSEL PRESSURE WINDOWSHigh-Strength Pressurized Windows in spacecrafts, high-altitude aircraft and deep sea submersible vessels demand ZWLCT ™ when edge strength is critical. Combined with Fonon’s patented Extra Low Pressure Grinding Technology (ELPGT™), grinding, lapping and polishing multi-vessel pressure window applications ensures the highest quality and reliability when there is no margin for error. |
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DNA HISTOLOGY GLASS SLIDESFonon Technology has ZWLCT ™ application specific cutting systems that manufacture highvolume histology slides creating no glass particulates that could contaminate the entire working surface potentially corrupting DNA samples |
Fonon Corporation Submits the Company’s SEC-10-Q Report
May 13, 2015
Fonon Corporation Submits the Company’s SEC-10-Q Report
PRESS RELEASE
May 14, 2015
FOR IMMEDIATE RELEASE
LAKE MARY, FL-(MarketWired-May 14, 2015) – Fonon Corporation (“Fonon”) a trade name for Mabwe Minerals Inc. (OTCQB: MBMI), has issued its quarterly report on SEC-Form 10-Q to assist current shareholders in understanding its transition to a new business model. The company’s Total Shareholder Equity reflected on its balance sheet as of March 31, 2014 is $10.4M.
Upon final approval by the SEC/FINRA, Fonon intends to change the official name of the company from Mabwe Minerals Inc. to Fonon Corporation, and to change the ticker symbol accordingly.
Dmitriy Nikitin, CEO/President of Fonon, commented, “Transitioning into the new business model provides the company with the ability to raise debt-free capital. Use of proceeds will be focused on the business of 3D FUSION™ or 3D Direct Metal Laser Sintering (DMLS), an emerging Additive Manufacturing technology, and improvements of manufacturing capabilities.”
Click-Here for SEC Form-10-Q filing
About Fonon Corporation
Fonon Corporation is the recognized leader of industrial-grade 3D Additive and Subtractive laser-based material processing systems. Our systems are used world-wide in the semiconductor, flat panel display, automotive, aerospace, industrial, defense, electronic and medical industries with a portfolio of intellectual property, knowhow & inventions placing our company in the unique position to offer both standard 3D material processing systems or our specialty of tooling 3D laser-based transforming systems designed around the unique applications of our customers.
To learn more about Fonon Corporation, visit: https://fonon.us
Notice Regarding Forward-Looking Statements:
NOTE: This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 involving risks and uncertainties. Results, events and performances could vary from those contemplated. These statements involve risks and uncertainties which may cause results, expressed or implied, to differ from predicted outcomes. Risks and uncertainties include but are not limited to product demand, market competition and the company’s ability to meet current and future plans. Investors should study and understand all risks before making an investment decision. Readers are recommended not to place undue reliance on forward-looking statements or information. Fonon is not obligated to publicly release revisions to any forward-looking statement, to reflect events or circumstances afterward, or to disclose unanticipated occurrences except as required under applicable law