Products
Cutting edge laser technologies that drive material processing in the semiconductor industry.
Fonon Technologies DefenseTech Semiconductor Processing offers cutting-edge laser technologies that revolutionize backend-of-the-line (BEOL) processing in the semiconductor industry. Our advanced systems provide precision and efficiency for wafer dicing, wafer serialization and chip package marking, delivering significant cost and performance benefits. With state-of-the-art laser dicing and marking solutions, we empower industries such as military, defense, and aerospace with innovative, high-quality processing capabilities.
The BlackStar is a wafer dicing system powered by the patented Fantom Width Laser Dicing Technology ™ (FWLDT™) developed to produce a clean, near-zero kerf without micro-cracks, fragmentation, or chipping.
The DefenseTech Wafer Marking system is specifically designed for automated serialization of various wafer materials in an enclosed work cell. The DTWM-7020 is equipped with a high-precision laser to ensure consistency and accuracy.
The DefenseTech Chip Packaging system is specifically designed for marking molding compounds that encapsulate and protect integrated circuits is a delicate task that requires precision and speed. The DTCP-7030 laser system offers the utmost control in the permanent marking of even the smallest chip packaging, greatly optimizing this step in manufacturing.
Fonon Technologies’ DefenseTech Semiconductor Processing Systems deliver precision solutions for the semiconductor industry, specializing in wafer dicing, wafer marking, and chip packaging marking. Our advanced laser technologies, including the BlackStar 7010 for clean, near-zero kerf dicing, the Wafer Marking 7020 for automated serialization, and the Chip Packaging 7030 for precise marking of molding compounds, ensure high accuracy, minimal heat impact, and enhanced efficiency across critical manufacturing processes.
Designed for the accurate tracking of wafer data, this system uses a high-precision laser to mark various wafer materials with consistent accuracy. Equipped with a SCARA wafer robot for seamless transfer and a pre-aligner for exact positioning, the DTWM-7020 ensures efficient, reliable serialization, streamlining production and enhancing traceability in semiconductor manufacturing.
Near-zero kerf cuts without micro-cracks or chipping, producing high-quality semiconductor dies for military applications. This precision enhances the reliability of defense electronics, minimizing waste and maximizing yield in high-stakes production environments.
Automated serialization and hiqh-quality marking enables military and defense companies to track semiconductor wafers with unparalleled accuracy. Using high-precision lasers and robotic automation, it ensures permanent, tamper-proof markings, supporting secure inventory management and compliance with strict defense regulations.
Fonon Technologies provides ultraviolet laser marking for chip molding compounds, ensuring precise, heat-minimal marking of even the smallest packages. This technology delivers durable, high-resolution marks critical for military-grade integrated circuits, enhancing longevity and performance in rugged defense applications.
© 2026 Fonon Technologies — All Rights Reserved | Privacy Policy | Terms Of Service
Cage Code: 7EBG2 | Unique Entity ID: C1TLM1LG6NE5